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Newsletter #5 - April 2020 Edition
Due to the COVID-19 crisis, several
ESSIAL events were postponed until further notice. Nonetheless
the consortium keeps working!
In this edition, we will focus on: new ESSIAL members, our latest
publications, project meetings and events.
Stay home | Stay safe | Take care
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Our partner Andaltec
was supposed to organise an ESSIAL International Technical Workshop
on 26 March 2020, in Martos (Jaén), Spain. Therefore, the event
is postponed. > More information
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Also
postponed: the workshop on Functional Adhesives for Electrical and
Electronic Industries, foreseen on 20 March 2020 at Carlos III University
(Madrid). > More information
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Both events will be rescheduled at a later date.
More information soon!
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Two PhD fellows have recently joined ESSIAL within
JEUMONT Electric / ESIEE Amiens: Préscillia Dupont (in
April 2019) and Théo Etifier (in January 2020).
Below, their interviews in which they explain their
background and role in the project! 👇
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Three
research articles related to ESSIAL have been accepted and will be
published in the Journal of
Magnetism and Magnetic Materials. These
research articles have been produced by members of the consortium
in the following partner institutions: CRM, ESIEE, IRT-M2P,
Multitel and UPJV.
Discover the scientific publications:
- The tensor magnetic phase theory
for mesoscopic volume structures of soft magnetic materials –
Quasi-static and dynamic vector polarization, apparent
permeability and losses – Experimental identifications of GO
steel at low induction levels. O.
Maloberti, M. Nesser, E. Salloum, S. Panier, J. Fortin, P.
Dassonvalle, C. Pineau, T. Nguyen, J.-P. Birat, I.
Tolleneere
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The last
ESSIAL General Assembly meeting took place in Metz (France) on
16-17 October 2019 at IRT-M2P and MetaFensch. > More information
The next
meeting will be organised virtually
on 18-19
May 2020 to monitor the progress of working groups.
More information soon on ESSIAL Website!
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ESSIAL has
received funding from the European’s Union Horizon 2020 research
and innovation programme under grant agreement No 766437
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